Advanced Materials
Copper Clad Laminates
TR-Clad™ Flexible Laminates
TR-Clad™ Flexible Laminates combine NeXolve polyimide materials with copper foil to provide the lowest dielectric constant, thinnest, and lowest weight copper/polyimide laminates available. Additionally, TR-Clad™ is available with electrostatic dissipative polyimide.
TR-Clad™ (short for “Transmit/Receive-Clad”) is a fundamental building block for ultra-lightweight flexible circuits and flexible antennas. TR-Clad™ Flexible Laminates are starting materials from which flexible circuits and flexible antennas are etched with lithographic processes.
Lowest Dielectric Constant
TR-Clad™ exhibits a record low dielectric constant of 2.5, which is much lower than the dielectric constant of 3.4 to 3.7 reported for competitive materials of all polyimide construction. Such a remarkably low dielectric constant reduces cross-talk between circuit traces and provides finer feature sizes and allows for higher frequencies. This enables high data-rate applications and additional miniaturization, which provides for additional lowering of the final product weight.
Thinnest and Lightest Weight Copper Clad Polyimide Laminates
Electrostatic Dissipative Polyimide
TR-Clad™ Flexible Laminates are the first, and so far the only, copper/polyimide laminates with grades available using electrostatically-dissipative (ESD) polyimide. A low level of surface electrical conductivity (10^8-10^12 ohm/sq) is required in many applications requiring ESD functionality to prevent static charge buildup that damages sensitive microchip circuitry affixed to the TR-Clad™ portion of the flexible circuit.
Availability
TR-Clad Rolls:
- 9 or 12 micron copper. Custom thicknesses available upon request
- 2, 5, 12 micron polyimide. Custom thicknesses available upon request
- ESD or non-ESD
- Polyimide coating can be custom formulated as-required
- Aluminum foil in place of copper is also available